US 12,237,251 B2
Semiconductor package including connection pad including groove pattern
Si Yun Kim, Icheon-si (KR); Kang Hun Kim, Icheon-si (KR); and Jun Yong Song, Icheon-si (KR)
Assigned to SK hynix Inc., Icheon-si (KR)
Filed by SK hynix Inc., Icheon-si (KR)
Filed on Apr. 7, 2022, as Appl. No. 17/715,722.
Claims priority of application No. 10-2021-0157050 (KR), filed on Nov. 15, 2021.
Prior Publication US 2023/0154835 A1, May 18, 2023
Int. Cl. H01L 23/00 (2006.01); H01L 23/498 (2006.01)
CPC H01L 23/49816 (2013.01) [H01L 23/49838 (2013.01); H01L 24/48 (2013.01); H01L 2224/48229 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A semiconductor package comprising:
a package substrate;
a connection pad including a recessed portion disposed on one surface of the package substrate; and
an insulating pattern disposed on the one surface of the package substrate,
wherein the connection pad comprises:
an outer sidewall;
an inner sidewall in the recessed portion, the inner sidewall inclining in an inward direction from an upper portion; and
a groove pattern formed on the inner sidewall,
wherein the connection pad and the insulating pattern are spaced apart from each other by a distance in a lateral direction to form an empty space on the one surface of the package substrate.