US 12,237,249 B2
Substrates with solder barriers on leads
Bernardo Gallegos, McKinney, TX (US); and Madison Koziol, Richardson, TX (US)
Assigned to TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed by TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US)
Filed on Oct. 30, 2018, as Appl. No. 16/175,279.
Prior Publication US 2020/0135627 A1, Apr. 30, 2020
Int. Cl. H01L 23/495 (2006.01); H01L 21/48 (2006.01); H01L 23/00 (2006.01)
CPC H01L 23/49582 (2013.01) [H01L 21/4846 (2013.01); H01L 23/4952 (2013.01); H01L 23/49586 (2013.01); H01L 24/81 (2013.01); H01L 2224/81815 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A system comprising:
a metal substrate, the metal substrate comprising a lead;
a solder barrier on the lead projecting through a plane along a top surface of the lead, the solder barrier including a rectangular shape from a top view of the system wherein the solder barrier is not exposed from a surface of the system;
a solder bump adjacent the solder barrier, wherein the solder barrier is only on one side of the solder bump;
a die having an active surface coupled to the solder bump; and
a first mold compound contacting portions side surface of the lead, a bottom surface and the active surface of the die.