US 12,237,234 B2
Alignment process for the transfer setup
Gholamreza Chaji, Waterloo (CA)
Assigned to VueReal, Waterloo (CA)
Appl. No. 17/613,259
Filed by VueReal Inc., Waterloo (CA)
PCT Filed May 22, 2020, PCT No. PCT/IB2020/054911
§ 371(c)(1), (2) Date Nov. 22, 2021,
PCT Pub. No. WO2020/234850, PCT Pub. Date Nov. 26, 2020.
Claims priority of provisional application 62/930,982, filed on Nov. 5, 2019.
Claims priority of provisional application 62/851,189, filed on May 22, 2019.
Prior Publication US 2022/0223483 A1, Jul. 14, 2022
Int. Cl. H01L 25/075 (2006.01); H01L 21/66 (2006.01)
CPC H01L 22/20 (2013.01) [H01L 25/0753 (2013.01); H01L 2223/54426 (2013.01)] 25 Claims
OG exemplary drawing
 
1. A method of aligning a first substrate and a second substrate comprising:
positioning the first substrate in close proximity to the second substrate, wherein the first substrate has at least a first alignment mark comprising four plates and wherein the second substrate has at least a second alignment mark comprising a single plate, and wherein the close proximity is a proximity at which the first alignment mark and the second alignment mark form a capacitance;
measuring an alignment value between the first and second alignment marks of both the first and second substrate; and
adjusting the position of the first substrate and the second substrate based on the measured alignment value.