CPC H01L 21/6833 (2013.01) [H01J 37/32724 (2013.01); H01L 21/67109 (2013.01); H01L 21/6831 (2013.01); H01J 2237/002 (2013.01); H01J 2237/2007 (2013.01)] | 22 Claims |
1. A top plate of an electrostatic chuck for a substrate processing system, the top plate bonded to a baseplate of the electrostatic chuck, the top plate comprising:
a body of the top plate comprising a first zone and a second zone, wherein the second zone is arranged radially outside of the first zone;
first coolant gas grooves disposed in the first zone; and
second coolant gas grooves disposed in the second zone, wherein the second coolant gas grooves comprise a plurality of distinct sets of coolant gas grooves separated by gaps such that the plurality of distinct sets of coolant gas grooves are not fluidically coupled to each other, and wherein the second coolant gas grooves comprise
a plurality of radially extending coolant gas grooves extending along respective radii of the body, and
three or more coolant gas grooves that are not continuous and extend annularly away from one of the plurality of radially extending coolant gas groves and do not extend to fluidically couple another gas groove.
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