US 12,237,200 B2
Lift pin interface in a substrate support
Alexander Sulyman, San Francisco, CA (US)
Assigned to APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed by APPLIED MATERIALS, INC., Santa Clara, CA (US)
Filed on Jul. 20, 2021, as Appl. No. 17/380,233.
Claims priority of provisional application 63/055,148, filed on Jul. 22, 2020.
Prior Publication US 2022/0028720 A1, Jan. 27, 2022
Int. Cl. H01L 21/683 (2006.01); H01J 37/32 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/6833 (2013.01) [H01J 37/32715 (2013.01); H01L 21/68742 (2013.01); H01J 2237/2007 (2013.01); H01J 2237/20235 (2013.01); H01J 2237/334 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A lift pin interface in an electrostatic chuck, comprising:
a dielectric plate having a support surface for a substrate;
a conductive plate disposed beneath the dielectric plate and having an opening formed therethrough,
wherein the dielectric plate includes a protrusion extending into the opening in the conductive plate; and
a lift pin guide disposed in the opening, wherein the lift pin guide includes one or more features that extend from an upper surface of the lift pin guide and that overlap with the protrusion of the dielectric plate, wherein the one or more features include at least one shoulder,
wherein the protrusion in the dielectric plate includes a countersink that mates with a shoulder of the at least one shoulder, and wherein the lift pin guide includes a passageway to accommodate a lift pin.