| CPC H01L 21/67772 (2013.01) | 21 Claims |

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1. A cassette lid opening device for a semiconductor substrate processing apparatus, wherein the cassette lid opening device comprises:
a housing having at least one wall with an associated wall opening;
a door assembly comprising at least one door plate configured for substantially closing off the associated wall opening of the at least one wall;
a transport mechanism including a carriage which is connected to the door assembly and configured to transport the door assembly parallel to the at least one wall between a first position in front of the associated wall opening and a second position laterally away from the associated wall opening so as to allow passage of wafers through the associated wall opening; and
at least one suspension arranged between the at least one door plate and the transport mechanism, wherein the at least one suspension comprises a suspension spring assembly which allows movement of the at least one door plate in a direction perpendicular to the at least one wall,
wherein the at least one suspension comprises:
a door assembly suspension comprising the suspension spring assembly, wherein the suspension spring assembly of the door assembly suspension comprises two parallel blade springs which are each connected with a first longitudinal edge to the carriage and which are each connected with a second longitudinal edge to the door assembly.
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