US 12,237,185 B2
Laser machining apparatus and laser machining method
Heung Yeol Na, Suwon-si (KR); Tae Hun Kim, Suwon-si (KR); and Jung Woo Choi, Asan-si (KR)
Assigned to SAMSUNG DISPLAY CO., LTD., Gyeonggi-Do (KR)
Filed by Samsung Display Co., LTD., Yongin-si (KR)
Filed on Jan. 31, 2022, as Appl. No. 17/588,535.
Claims priority of application No. 10-2021-0070516 (KR), filed on Jun. 1, 2021.
Prior Publication US 2022/0384219 A1, Dec. 1, 2022
Int. Cl. B23K 26/12 (2014.01); B23K 26/00 (2014.01); B23K 26/16 (2006.01); B65H 23/00 (2006.01); B65H 75/44 (2006.01); H01L 21/67 (2006.01); B23K 103/00 (2006.01)
CPC H01L 21/67115 (2013.01) [B23K 26/0006 (2013.01); B23K 26/009 (2013.01); B23K 26/127 (2013.01); B23K 26/16 (2013.01); B65H 23/00 (2013.01); B65H 75/4481 (2013.01); H01L 21/67282 (2013.01); B23K 2103/56 (2018.08); B65H 2301/314 (2013.01); B65H 2301/50 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A laser machining apparatus comprising:
a processing chamber;
a window disposed in a surface of the processing chamber;
a substrate carrier disposed inside the processing chamber and facing the window;
a laser irradiator which irradiates a laser onto the substrate carrier through the window;
a protector supplier disposed on a side of the processing chamber;
a protector retriever disposed on an opposite side of the processing chamber opposite to the side of the processing chamber; and
a protector which connects the protector supplier with the protector retriever, wherein at least a portion of the protector is disposed between the substrate carrier and the window in the processing chamber.