US 12,237,184 B1
Heating structure and wafer test device
Zhe Lian, Suzhou (CN); Bin Zhou, Suzhou (CN); Xiaoming Guo, Suzhou (CN); and Pengsong Xu, Suzhou (CN)
Assigned to SEMIGHT INSTRUMENTS CO., LTD, Suzhou (CN)
Filed by SEMIGHT INSTRUMENTS CO., LTD, Suzhou (CN)
Filed on Jan. 30, 2024, as Appl. No. 18/427,094.
Application 18/427,094 is a continuation of application No. PCT/CN2023/134135, filed on Nov. 24, 2023.
Claims priority of application No. 202323056450.6 (CN), filed on Nov. 13, 2023.
Int. Cl. G01R 31/28 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67103 (2013.01) [G01R 31/2875 (2013.01); H01L 21/68771 (2013.01)] 10 Claims
OG exemplary drawing
 
1. A heating structure, comprising:
a heating base, wherein a heating element is disposed in the heating base;
a mounting component, disposed above the heat base and including a plurality of mounting stations arranged at intervals; and
a plurality of insulating thermo-conductive blocks, wherein each of the plurality of insulating thermo-conductive blocks is disposed at one corresponding mounting station of the plurality of mounting stations and protrudes from the mounting component for contacting a clamp of a wafer test device.