US 12,237,181 B2
Support unit and substrate treating apparatus
Ho Jong Hwang, Hwaseong-si (KR); Do Yeon Kim, Yongin-si (KR); and Hyun Yoon, Hwaseong-si (KR)
Assigned to Semes Co., Ltd., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Mar. 24, 2022, as Appl. No. 17/703,255.
Prior Publication US 2023/0307260 A1, Sep. 28, 2023
Int. Cl. H01L 21/67 (2006.01); B08B 3/02 (2006.01); B08B 3/04 (2006.01); B08B 3/08 (2006.01); H01L 21/687 (2006.01)
CPC H01L 21/67051 (2013.01) [B08B 3/022 (2013.01); B08B 3/041 (2013.01); B08B 3/08 (2013.01); H01L 21/68764 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate treating apparatus, comprising:
a cup having a treatment space therein;
a support unit configured to support a substrate within the treatment space, and including a rotatable support plate; and
a liquid discharge unit configured to discharge a chemical liquid to the substrate supported by the support unit,
wherein the support unit includes:
a plurality of pin members provided to the support plate configured to support the substrate placed on the support plate; and
a discharge member coupled to the pin member configured to discharge charges to air according to a rotation of the support plate, and the discharge member is provided as a conductive member,
wherein the discharge member is positioned above the support plate and spaced apart from the support plate.