US 12,237,179 B2
Fittings for wafer cleaning systems
Cheng-Ping Chen, Taichung (TW); Ping-Shen Chou, Hsinchu (TW); Tsung-Lung Lai, Hsinchu (TW); Ching-Wen Cheng, Zhubei (TW); and Chun Yan Chen, Zhubei (TW)
Assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Hsinchu (TW)
Filed on Feb. 15, 2022, as Appl. No. 17/671,664.
Claims priority of provisional application 63/232,276, filed on Aug. 12, 2021.
Prior Publication US 2023/0051164 A1, Feb. 16, 2023
Int. Cl. B08B 1/12 (2024.01); F16L 23/024 (2006.01); H01L 21/67 (2006.01)
CPC H01L 21/67046 (2013.01) [B08B 1/12 (2024.01); F16L 23/024 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A wafer cleaning system, comprising:
a brush scrubbing chamber having an upper brush that is attached to a rotatable shaft of an upper arm; and
a fitting attached to a support bar of the upper arm, the fitting comprising:
a base plate comprising a threaded hole with a stop surface therein and a channel extending from the stop surface through a lower surface of the base plate;
a flanged pipe comprising a hollow tube and a flange at a top end of the hollow tube, inserted into the base plate such that the flange rests on the stop surface and the hollow tube passes through the channel of the base plate and into the rotatable shaft; and
a threaded connector having a passage therethrough, the threaded connector engaging the threaded hole of the base plate to fix the flanged pipe in place;
wherein the flanged pipe cannot contact the upper brush.