US 12,237,177 B2
Substrate processing apparatus and substrate processing method
Shogo Fukui, Koshi (JP); Masataka Gosho, Koshi (JP); Satoshi Okamura, Koshi (JP); and Tomohito Ura, Koshi (JP)
Assigned to TOKYO ELECTRON LIMITED, Tokyo (JP)
Filed by Tokyo Electron Limited, Tokyo (JP)
Filed on Feb. 4, 2022, as Appl. No. 17/649,933.
Claims priority of application No. 2021-018400 (JP), filed on Feb. 8, 2021.
Prior Publication US 2022/0254658 A1, Aug. 11, 2022
Int. Cl. H01L 21/67 (2006.01); H01L 21/683 (2006.01)
CPC H01L 21/67034 (2013.01) [H01L 21/683 (2013.01)] 9 Claims
OG exemplary drawing
 
1. A substrate processing apparatus configured to dry a substrate having a liquid film formed on a pattern formation surface thereof with a supercritical fluid, the substrate processing apparatus comprising:
a processing vessel which is configured to accommodate the substrate therein and into which the supercritical fluid is supplied;
a substrate holder which has a base member configured to support the substrate from below while allowing the pattern formation surface of the substrate to face upwards, and which is configured to hold the substrate within the processing vessel;
a first detector configured to detect an inclination of the base member with respect to a horizontal plane,
a posture adjusting device configured to adjust the inclination of the base member with respect to the horizontal plane,
a controller configured to control the posture adjusting device to perform horizontal leveling of the base member based on a detection result of the first detector, and
a second detector configured to detect a height position of a surface of the liquid film formed on a top surface of the substrate supported by the base member,
wherein the base member includes a base member main body, multiple supporting members protruding upwards from the base member main body to support the substrate from below, and a lifting device configured to move the multiple supporting members up and down with respect to the base member main body, and
the controller performs the horizontal leveling of the base member by the posture adjusting device based on the detection result of the first detector, and then performs height adjustment of the height position of the surface of the liquid film by the lifting device based on a detection result of the second detector.