US 12,237,176 B2
Electronic device and manufacturing method and inspection method thereof using transmittance of dielectric
Kuang-Ming Fan, Miao-Li County (TW); Chia-Lin Yang, Miao-Li County (TW); and Liang-Lu Chen, Miao-Li County (TW)
Assigned to InnoLux Corporation, Miao-Li County (TW)
Filed by InnoLux Corporation, Miao-Li County (TW)
Filed on May 4, 2022, as Appl. No. 17/736,997.
Claims priority of application No. 202110914382.9 (CN), filed on Aug. 10, 2021; and application No. 202210016294.1 (CN), filed on Jan. 7, 2022.
Prior Publication US 2023/0049123 A1, Feb. 16, 2023
Int. Cl. H01L 21/48 (2006.01); H01L 21/66 (2006.01); H01L 23/498 (2006.01)
CPC H01L 21/4857 (2013.01) [H01L 22/12 (2013.01); H01L 23/49822 (2013.01)] 19 Claims
OG exemplary drawing
 
1. An electronic device, comprising:
a connector comprising a conductive layer, a first dielectric layer, and a second dielectric layer, wherein the second dielectric layer is disposed on the first dielectric layer, the conductive layer is disposed between the first dielectric layer and the second dielectric layer, the first dielectric layer has a first transmittance for a light, the second dielectric layer has a second transmittance for the light, and the first transmittance is different from the second transmittance.