| CPC H01J 37/3417 (2013.01) [C23C 14/3407 (2013.01); C23C 14/3414 (2013.01); H01J 37/3423 (2013.01); H01L 21/0337 (2013.01)] | 20 Claims |
|
1. A deposition apparatus, comprising:
a process chamber;
a wafer support in the process chamber;
a backplane structure having a first surface in the process chamber facing the wafer support, the backplane structure having a first machine lock pattern including a plurality of first peaks and a plurality of first valleys;
a target having a second surface facing the first surface and a third surface facing the wafer support, the target having a second machine lock pattern including a plurality of second peaks and a plurality of second valleys; and
an adhesion structure in physical contact with the backplane structure and the target, comprising:
an adhesion material layer; and
a spacer embedded in the adhesion material layer;
wherein a first surface of the adhesion material layer has shape corresponding to the plurality of first peaks and the plurality of first valleys, and a second surface of the adhesion material layer has shape corresponding to the plurality of second peaks and the plurality of second valleys,
wherein the first machine lock pattern includes a plurality of grooves that align with the spacer, each of the plurality of grooves being deeper than the plurality of first valleys.
|