	US 12,237,152 B2
	Two-dimensional electronic component and method of manufacturing same
Ching-Yuan Su, Taoyuan (TW); and En Yi Liao, Taoyuan (TW)
Assigned to NATIONAL CENTRAL UNIVERSITY, Taoyuan (TW)
Filed by National Central University, Taoyuan (TW)
Filed on Apr. 26, 2022, as Appl. No. 17/730,073.
Claims priority of provisional application 63/252,816, filed on Oct. 6, 2021.
Prior Publication US 2023/0105515 A1, Apr. 6, 2023
Int. Cl. H01L 29/24 (2006.01); H01J 37/32 (2006.01); H01J 37/34 (2006.01); H01L 21/02 (2006.01); H01L 29/26 (2006.01); H01L 29/66 (2006.01); H01L 29/76 (2006.01); H01L 29/786 (2006.01); H01L 29/06 (2006.01); H01L 29/423 (2006.01)

CPC H01J 37/32449 (2013.01) [H01J 37/3476 (2013.01); H01L 21/02568 (2013.01); H01L 29/24 (2013.01); H01L 29/242 (2013.01); H01L 29/26 (2013.01); H01L 29/66969 (2013.01); H01L 29/7606 (2013.01); H01L 29/78696 (2013.01); H01J 2237/332 (2013.01); H01J 2237/334 (2013.01); H01L 29/0665 (2013.01); H01L 29/42392 (2013.01)]

15 Claims

1. A two-dimensional electronic component, comprising:

a substrate;

an artificial two-dimensional (2D) material disposed on the substrate; and

a first metallic electrode disposed on the artificial 2D material;

wherein the artificial 2D material includes a layered atomic structure including a middle atomic layer, a lower atomic layer disposed on a lower surface of the middle atomic layer, and an upper atomic layer disposed on an upper surface of the middle atomic layer respectively; and

wherein the upper atomic layer and the first metallic electrode are attracted together at a junction therebetween by metallic bonding.