US 12,237,116 B2
Capacitor and method for manufacturing same
Youhei Hashimoto, Tokyo (JP); Kouichi Nakata, Tokyo (JP); Ryuuta Inoue, Tokyo (JP); and Keisuke Matsuhira, Tokyo (JP)
Assigned to NIPPON CHEMI-CON CORPORATION, Tokyo (JP)
Appl. No. 17/913,279
Filed by NIPPON CHEMI-CON CORPORATION, Tokyo (JP)
PCT Filed Mar. 25, 2021, PCT No. PCT/JP2021/012457
§ 371(c)(1), (2) Date Sep. 21, 2022,
PCT Pub. No. WO2021/193794, PCT Pub. Date Sep. 30, 2021.
Claims priority of application No. 2020-055817 (JP), filed on Mar. 26, 2020.
Prior Publication US 2023/0142563 A1, May 11, 2023
Int. Cl. H01G 2/06 (2006.01); H01G 9/10 (2006.01); H01G 9/00 (2006.01); H01G 9/048 (2006.01); H01G 9/145 (2006.01)
CPC H01G 9/10 (2013.01) [H01G 2/06 (2013.01); H01G 9/00 (2013.01); H01G 9/048 (2013.01); H01G 9/145 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A capacitor comprising:
a capacitor main body including an outer package case, an opening sealing member that has a first insertion through hole portion and that is attached to an opening of the outer package case, and a terminal lead led out from the first insertion through hole portion;
a base disposed on a side of the opening sealing member of the capacitor main body, the base having a second insertion through hole portion through which the terminal lead is inserted to expose the terminal lead on a side of a substrate mounting face; and
resin layers including a first resin layer disposed between the base and the opening sealing member and a second resin layer, wherein
the base includes a first protruding portion surrounding the second insertion through hole portion, so that the second insertion through hole portion of the base forms an insertion through hole; or the opening sealing member includes a second protruding portion that surrounds the first insertion through hole portion and that contacts the base, so that the second insertion through hole portion of the base and the first insertion through hole portion surrounded by the second protruding portion form an insertion through hole, wherein
the first resin layer is adjacent to the first protruding portion or the second protruding portion, wherein
the second resin layer is disposed inside the insertion through hole, and wherein
an opening distance on the side of the substrate mounting face of the insertion through hole is larger than an opening distance on a side of the capacitor main body of the insertion through hole.