CPC H01B 1/22 (2013.01) [H01B 5/16 (2013.01)] | 16 Claims |
1. A connection structure, comprising:
a first electronic component having a first terminal;
a second electronic component having a second terminal; and
a cured film provided between the first electronic component and the second electronic component and formed by curing a connection material containing coated conductive particles comprising a core material particle, a conductive layer provided on the surface of the core material particle, and metal fine particles coating the surface of the conductive layer,
wherein, with regard to the coated conductive particles between the first terminal and the second terminal, metal atoms of the conductive layer diffuse into the metal of the metal fine particles, and metal atoms of the first terminal and metal atoms of the second terminal diffuse into the metal of the metal fine particles,
wherein the coated conductive particles have a plurality of protrusions on a surface of the conductive layer, and
wherein the metal fine particles coat the surface of the protrusions and the surface of the conductive layer.
|