US 12,237,096 B2
Connection structure, method of manufacturing connection structure, connection material, and coated conductive particle
Yusuke Tanaka, Tochigi (JP); Masaharu Aoki, Tochigi (JP); Saori Sugioka, Tochigi (JP); Hidetsugu Namiki, Tochigi (JP); and Shoko Kuga, Tochigi (JP)
Assigned to DEXERIALS CORPORATION, Shimotsuke (JP)
Appl. No. 17/607,466
Filed by DEXERIALS CORPORATION, Shimotsuke (JP)
PCT Filed Apr. 23, 2020, PCT No. PCT/JP2020/017582
§ 371(c)(1), (2) Date Oct. 29, 2021,
PCT Pub. No. WO2020/222301, PCT Pub. Date Nov. 5, 2020.
Claims priority of application No. 2019-087150 (JP), filed on May 1, 2019; and application No. 2020-076961 (JP), filed on Apr. 23, 2020.
Prior Publication US 2022/0223315 A1, Jul. 14, 2022
Int. Cl. H01B 1/22 (2006.01); H01B 5/16 (2006.01)
CPC H01B 1/22 (2013.01) [H01B 5/16 (2013.01)] 16 Claims
OG exemplary drawing
 
1. A connection structure, comprising:
a first electronic component having a first terminal;
a second electronic component having a second terminal; and
a cured film provided between the first electronic component and the second electronic component and formed by curing a connection material containing coated conductive particles comprising a core material particle, a conductive layer provided on the surface of the core material particle, and metal fine particles coating the surface of the conductive layer,
wherein, with regard to the coated conductive particles between the first terminal and the second terminal, metal atoms of the conductive layer diffuse into the metal of the metal fine particles, and metal atoms of the first terminal and metal atoms of the second terminal diffuse into the metal of the metal fine particles,
wherein the coated conductive particles have a plurality of protrusions on a surface of the conductive layer, and
wherein the metal fine particles coat the surface of the protrusions and the surface of the conductive layer.