US 12,237,048 B2
Memory device, memory system having the same, and method of operating the same
Hijung Kim, Suwon-si (KR); Kwangchol Choe, Seoul (KR); Kwangsook Noh, Suwon-si (KR); and Jaepil Lee, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Jun. 29, 2022, as Appl. No. 17/852,593.
Claims priority of application No. 10-2021-0158855 (KR), filed on Nov. 17, 2021.
Prior Publication US 2023/0186960 A1, Jun. 15, 2023
Int. Cl. G11C 7/22 (2006.01); G11C 7/10 (2006.01); G11C 7/12 (2006.01); G11C 8/14 (2006.01); H03K 19/017 (2006.01)
CPC G11C 7/222 (2013.01) [G11C 7/1039 (2013.01); G11C 7/12 (2013.01); G11C 8/14 (2013.01); H03K 19/01742 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A memory device comprising:
a memory cell array having memory cells connected to wordlines and bitlines; and
a clock buffer configured to receive a clock signal for performing a read operation or a write operation on at least one of the memory cells,
wherein the clock buffer includes a plurality of serially connected clock repeaters, and
wherein the plurality of clock repeaters include at least one pair of clock repeaters comprising a first clock repeater in which a driving capability of a P-channel metal oxide semiconductor (PMOS) transistor is higher than a driving capability of an N-channel metal oxide semiconductor (NMOS) transistor, and a second clock repeater in which a driving capability of a PMOS transistor is lower than a driving capability of an NMOS transistor.