US 12,236,706 B2
Fingerprint sensor and electronic device
Dexi Kong, Beijing (CN); Cheng Li, Beijing (CN); Lin Zhou, Beijing (CN); Zixiao Chen, Beijing (CN); Gen Huang, Beijing (CN); Shoujin Cai, Beijing (CN); Jie Zhang, Beijing (CN); Jin Cheng, Beijing (CN); Yingzi Wang, Beijing (CN); Caixia Zhang, Beijing (CN); and Qian Tan, Beijing (CN)
Assigned to Beijing BOE Optoelectronics Technology Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 18/027,072
Filed by Beijing BOE Optoelectronics Technology Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Mar. 16, 2022, PCT No. PCT/CN2022/081281
§ 371(c)(1), (2) Date Mar. 17, 2023,
PCT Pub. No. WO2023/173342, PCT Pub. Date Sep. 21, 2023.
Prior Publication US 2024/0312240 A1, Sep. 19, 2024
Int. Cl. G06F 3/044 (2006.01); G06V 40/13 (2022.01)
CPC G06V 40/1318 (2022.01) 16 Claims
OG exemplary drawing
 
1. A fingerprint sensor, comprising:
a substrate;
a plurality of photosensitive devices disposed on the substrate;
a light-emitting module disposed on a side, distal to the substrate, of the plurality of photosensitive devices; and
a protective cover disposed on a side, distal to the substrate, of the light-emitting module, wherein the protective cover is provided with a plurality of conductive structures electrically connected to the light-emitting module, the plurality of conductive structures being in one-to-one correspondence with the plurality of photosensitive devices, and an orthographic projection of each conductive structure onto the substrate at least partially being overlapped with an orthographic projection of the photosensitive device corresponding to the conductive structure onto the substrate,
wherein the orthographic projection of each conductive structure onto the substrate falls within the orthographic projection of the photosensitive device corresponding to the conductive structure onto the substrate, an area of the orthographic projection of each conductive structure onto the substrate is less than or equal to an area of the orthographic projection of the photosensitive device corresponding to the conductive structure onto the substrate,
wherein a width of the orthographic projection of each conductive structure onto the substrate in a target direction is equal to a width of the orthographic projection of the photosensitive device corresponding to the conductive structure onto the substrate in the target direction; or
the width of the orthographic projection of each conductive structure onto the substrate in the target direction is equal to half of the width of the photosensitive device corresponding to the conductive structure onto the substrate in the target direction;
wherein the target direction is a row arrangement direction or a column arrangement direction of the plurality of photosensitive devices.