| CPC G06T 7/32 (2017.01) [G06T 3/4038 (2013.01); G06T 7/0004 (2013.01); H01L 21/67092 (2013.01); G06T 2207/30148 (2013.01)] | 2 Claims |
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1. A processing apparatus for generating a map of a wafer, in which a plurality of devices are demarcated by a plurality of first planned dividing lines extending in a first direction and a plurality of second planned dividing lines extending in a second direction orthogonal to the first direction and test element groups are formed on the first and second planned dividing lines, the processing apparatus comprising:
a rotatable chuck table configured to hold the wafer;
a processing unit configured to perform processing on the wafer held by the chuck table;
an X-axis feed mechanism configured to processing-feed the chuck table and the processing unit relative to each other in an X-axis direction;
a Y-axis feed mechanism configured to indexing-feed the chuck table and the processing unit relative to each other in a Y-axis direction which is orthogonal to the X-axis direction;
an operating unit for operating the X-axis feed mechanism and the Y-axis feed mechanism;
an imaging unit configured to image the wafer held by the chuck table and detect a region to be processed;
a display unit configured to display a region imaged by the imaging unit; and
a control unit;
the control unit including
an X-axis direction positioning section configured to detect a linear region corresponding to a first planned dividing line from an intersection region of the first planned dividing line and a second planned dividing line in an image obtained by imaging the wafer held on the chuck table by the imaging unit, obtain an angle between the linear region and the X-axis direction, and position the linear region corresponding to the first planned dividing line in the X-axis direction by rotating the chuck table,
a first planned dividing line interval setting section configured to actuate the Y-axis feed mechanism, detect a linear region corresponding to a next first planned dividing line, and set an interval between the first planned dividing lines,
a second planned dividing line interval setting section configured to actuate the X-axis feed mechanism, detect two linear regions corresponding to second planned dividing lines, the linear regions being adjacent to each other, and set an interval between the second planned dividing lines,
a device image generating section configured to generate and store one device image enclosed by a pair of adjacent first planned dividing lines and a pair of adjacent second planned dividing lines,
a reticle image extracting section configured to obtain a plurality of device images while moving the region to be imaged by the imaging unit in the X-axis direction and the Y-axis direction, couple the obtained plurality of device images by phase only correlation, and extract and store a reticle image including a plurality of devices and test element groups, and
a map generating section configured to generate the map of the wafer by coupling together a plurality of reticle images by phase only correlation.
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