US 12,236,571 B2
Integrated Dewar assembly with compliant endcap cooling
Adam R. Girard, Blue Ridge, TX (US); Gabriel A. Payan, McKinney, TX (US); Charlie Y. Chen, Frisco, TX (US); Christopher J. Cormier, Anna, TX (US); and Mark D. Sprinkel, Plano, TX (US)
Assigned to Raytheon Company, Arlington, VA (US)
Filed by Raytheon Company, Waltham, MA (US)
Filed on Sep. 16, 2022, as Appl. No. 17/933,014.
Claims priority of provisional application 63/252,512, filed on Oct. 5, 2021.
Prior Publication US 2023/0109525 A1, Apr. 6, 2023
Int. Cl. H04N 5/33 (2023.01); F17C 13/06 (2006.01); G06T 7/00 (2017.01)
CPC G06T 7/0004 (2013.01) [F17C 13/06 (2013.01); H04N 5/33 (2013.01); F17C 2201/0119 (2013.01); F17C 2205/0311 (2013.01); F17C 2223/0161 (2013.01); F17C 2227/0383 (2013.01); F17C 2227/0397 (2013.01); F17C 2260/031 (2013.01); F17C 2270/0509 (2013.01); G06T 2207/10048 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus comprising:
a Dewar having an endcap;
a heat sink; and
a thermal interface material configured to thermally couple the endcap of the Dewar to the heat sink, the thermal interface material comprising an amorphous pliable material that is configured to transfer thermal energy between the endcap of the Dewar and the heat sink without structurally coupling the Dewar to the heat sink.