US 12,236,570 B2
Appearance inspection system and appearance inspection method for tape packaging of electronic component devices
Ikuo Motonaga, Kitakyushu Fukuoka (JP)
Assigned to Kabushika Kaisha Toshiba, Tokyo (JP); and Toshiba Electronic Devices & Storage Corporation, Tokyo (JP)
Filed by KABUSHIKI KAISHA TOSHIBA, Tokyo (JP); and TOSHIBA ELECTRONIC DEVICES & STORAGE CORPORATION, Tokyo (JP)
Filed on Sep. 2, 2022, as Appl. No. 17/902,758.
Claims priority of application No. 2022-044151 (JP), filed on Mar. 18, 2022.
Prior Publication US 2023/0298151 A1, Sep. 21, 2023
Int. Cl. G06T 7/00 (2017.01); G01N 21/88 (2006.01); G01N 21/95 (2006.01); G06T 7/73 (2017.01); H04N 23/56 (2023.01)
CPC G06T 7/0004 (2013.01) [G01N 21/8851 (2013.01); G01N 21/95 (2013.01); G06T 7/73 (2017.01); H04N 23/56 (2023.01); G06T 2207/10048 (2013.01); G06T 2207/30148 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An inspection system, comprising:
an infrared imaging device for acquiring an image of a thermocompression-bonded tape package with infrared light from a single direction, the thermocompression-bonded tape package comprising a first tape fused to a second tape, the first tape covering the second tape, and the second tape having a pocket for an electronic component;
a first reel to supply the first tape;
a second reel to supply the second tape;
an infrared light source positioned to provide the infrared light from the single direction for imaging by the infrared imaging device; and
a controller configured to receive the image of the thermocompression-bonded tape package and detect a defect in the thermocompression bonding in a predetermined region of the tape package based on a single received image, wherein
the first tape on the first reel comprises a resin material that is at least partially transparent to the infrared light, and
the second tape on the second reel comprises a resin material that absorbs the infrared light.