| CPC G06N 5/04 (2013.01) [G01B 11/06 (2013.01); G03F 7/705 (2013.01); G03F 7/70616 (2013.01); G06N 20/00 (2019.01); H01L 21/681 (2013.01); H01L 22/26 (2013.01); G01B 2210/56 (2013.01)] | 18 Claims |

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1. A high-volume manufacturing semiconductor process control metrology system comprising:
a plurality of spectrum acquisition integrated metrology (IM) tools configured to collect, in accordance with a first measurement protocol, a baseline set of scatterometric spectra;
at least one reference metrology tool configured to provide, in accordance with a second measurement protocol, values of predefined parameters of semiconductor wafer targets;
at least one web server layer connectable to said integrated metrology tools and said at least one reference metrology tool;
a big data layer configured for storing and processing data in a scalable and distributed manner; and
a training unit configured to create a training set of the data from the collected sets of spectra and said values of the predefined parameters.
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