| CPC G06F 3/0655 (2013.01) [G06F 3/0604 (2013.01); G06F 3/0673 (2013.01)] | 18 Claims |
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1. A memory system comprising:
a memory module including
a control device,
a module temperature sensor configured to measure a module temperature, and
a plurality of semiconductor memory devices configured to store data, the plurality of semiconductor memory devices respectively including a plurality of temperature measurement circuits configured to measure a plurality of internal temperatures, wherein the plurality of internal temperatures are respective internal temperatures of the plurality of semiconductor memory devices; and
a memory controller configured to control the memory module,
wherein the memory system is configured to generate a reference offset value based on the module temperature and the plurality of internal temperatures and perform thermal throttling of the memory module based on the reference offset value and the module temperature, and
wherein the reference offset value corresponds to a maximum internal temperature of the plurality of internal temperatures subtracted by the module temperature.
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