| CPC G06F 3/041 (2013.01) [H05K 1/189 (2013.01); G06F 2203/04102 (2013.01); G06F 2203/04103 (2013.01)] | 14 Claims |
|
1. A flexible circuit board, having a first bonding area located at a peripheral region of the flexible circuit board and a bending area located at a middle region of the flexible circuit board, wherein the flexible circuit board comprises:
a flexible substrate;
a plurality of first bonding pins, provided in the first bonding area on the flexible substrate, and used for electrically connecting with a touch module through a conductive bonding adhesive layer, wherein an orthographic projection on the flexible substrate of an edge line of each first bonding pin is located within an edge of the flexible substrate, which edge line is located at an end along an extension direction of a first bonding pin;
a conductor layer, provided in the bending area on the flexible substrate, wherein the conductor layer is connected to the first bonding pins; and
a first protective layer, arranged on a side of the conductor layer away from the flexible substrate,
wherein
the conductor layer comprises a first conductive metal layer and a second conductive metal layer,
each of the first bonding pins comprises the first conductive metal layer and the second conductive metal layer,
the second conductive metal layer is a flash-plated copper layer,
a thickness of the second conductive metal layer is larger than or equal to 3 microns and less than or equal to 5 microns to ensure thicknesses of the first bonding pins and the conductor layer, and
the conductor layer and the first bonding pins are formed by the first conductive metal layer and the second conductive metal layer through a same patterning process.
|