US 12,235,582 B2
Semiconductor developer tool and methods of operation
Yung-Yao Lee, Zhubei (TW); and Chen Yi Hsu, Zhubei (TW)
Assigned to Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed by Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu (TW)
Filed on Jul. 24, 2023, as Appl. No. 18/357,347.
Application 18/357,347 is a continuation of application No. 17/303,525, filed on Jun. 1, 2021, granted, now 11,747,729.
Claims priority of provisional application 63/200,650, filed on Mar. 19, 2021.
Prior Publication US 2023/0367219 A1, Nov. 16, 2023
This patent is subject to a terminal disclaimer.
Int. Cl. G03F 7/16 (2006.01); H01L 21/027 (2006.01)
CPC G03F 7/162 (2013.01) [H01L 21/0274 (2013.01)] 20 Claims
OG exemplary drawing
 
15. A method, comprising:
rotating a substrate on a chuck;
dispensing, while the substrate is rotating on the chuck, a developer agent through one or more first nozzles of a first type onto a perimeter portion of the substrate;
dispensing, while the substrate is rotating on the chuck, the developer agent through one or more second nozzles of the first type onto a central portion of the substrate; and
dispensing, while the substrate is rotating on the chuck, the developer agent through one or more third nozzles of a second type onto the central portion of the substrate,
wherein a first quantity associated with the one or more first nozzles is fewer than a second quantity associated with the one or more second nozzles and the one or more third nozzles, and
wherein a first quantity of openings associated with the first type is fewer than a second quantity of openings associated with the second type.