US 12,235,579 B2
Method for producing actinic ray-sensitive or radiation-sensitive resin composition, pattern forming method, and method for manufacturing electronic device
Keiyu Ou, Shizuoka (JP); Naohiro Tango, Shizuoka (JP); Kei Yamamoto, Shizuoka (JP); and Kazuhiro Marumo, Shizuoka (JP)
Assigned to FUJIFILM Corporation, Tokyo (JP)
Filed by FUJIFILM Corporation, Tokyo (JP)
Filed on Dec. 13, 2021, as Appl. No. 17/548,595.
Application 17/548,595 is a continuation of application No. PCT/JP2020/018062, filed on Apr. 28, 2020.
Claims priority of application No. 2019-122288 (JP), filed on Jun. 28, 2019; and application No. 2020-030480 (JP), filed on Feb. 26, 2020.
Prior Publication US 2022/0107561 A1, Apr. 7, 2022
Int. Cl. G03F 7/004 (2006.01); C07C 309/17 (2006.01); C07C 309/42 (2006.01); C07C 311/09 (2006.01); C07C 311/48 (2006.01); C07C 311/51 (2006.01); C07C 381/12 (2006.01); C07D 327/06 (2006.01); C07D 327/08 (2006.01); C07D 333/46 (2006.01); C07D 333/76 (2006.01); C08F 220/18 (2006.01); C08F 220/28 (2006.01); G03F 7/038 (2006.01); G03F 7/039 (2006.01)
CPC G03F 7/0045 (2013.01) [C07C 309/17 (2013.01); C07C 309/42 (2013.01); C07C 311/09 (2013.01); C07C 311/48 (2013.01); C07C 311/51 (2013.01); C07C 381/12 (2013.01); C07D 327/06 (2013.01); C07D 327/08 (2013.01); C07D 333/46 (2013.01); C07D 333/76 (2013.01); C08F 220/1806 (2020.02); C08F 220/1807 (2020.02); C08F 220/1808 (2020.02); C08F 220/1809 (2020.02); C08F 220/1811 (2020.02); C08F 220/1812 (2020.02); C08F 220/1818 (2020.02); C08F 220/281 (2020.02); C08F 220/283 (2020.02); G03F 7/038 (2013.01); G03F 7/039 (2013.01); C07C 2603/74 (2017.05)] 10 Claims
OG exemplary drawing
 
1. A method for producing an actinic ray-sensitive or radiation-sensitive resin composition including at least:
a resin having a polarity that increases due to decomposition by an action of an acid;
a compound that generates an acid upon irradiation with actinic rays or radiation; and
a solvent,
in which the compound that generates an acid upon irradiation with actinic rays or radiation includes one or more compounds selected from the group consisting of the following compound (I) to the following compound (III),
the method comprising mixing a first solution including the resin having a polarity that increases by the action of an acid and a first solvent with the one or more compounds selected from the group consisting of the compound (I) to the compound (III) to produce the actinic ray-sensitive or radiation-sensitive resin composition:
compound (I): a compound having each one of the following structural moiety X and the following structural moiety Y, the compound generating an acid including the following first acidic moiety derived from the following structural moiety X and the following second acidic moiety derived from the following structural moiety Y upon irradiation with actinic rays or radiation,
structural moiety X: a structural moiety which consists of an anionic moiety A1− and a cationic moiety M1+, and forms a first acidic moiety represented by HA1 upon irradiation with actinic rays or radiation,
structural moiety Y: a structural moiety which consists of an anionic moiety A2− and a cationic moiety M2+, and forms a second acidic moiety represented by HA2, having a structure different from that of the first acidic moiety formed by the structural moiety X, upon irradiation with actinic rays or radiation,
provided that the compound (I) satisfies the following condition I:
condition I: a compound PI formed by substituting the cationic moiety M1+ in the structural moiety X and the cationic moiety M2+ in the structural moiety Y with H+ in the compound (I) has an acid dissociation constant a1 derived from an acidic moiety represented by HA1, formed by substituting the cationic moiety M1+ in the structural moiety X with H+, and an acid dissociation constant a2 derived from an acidic moiety represented by HA2, formed by substituting the cationic moiety M2+ in the structural moiety Y with H+, and the acid dissociation constant a2 is larger than the acid dissociation constant a1,
compound (II): a compound having the two or more structural moieties X and the structural moiety Y, the compound generating an acid including the two or more first acidic moieties derived from the structural moieties X and the second acidic moiety derived from the structural moiety Y upon irradiation with actinic rays or radiation,
provided that the compound (II) satisfies the following condition II:
condition II: a compound PII formed by substituting the cationic moiety M1V in the structural moiety X and the cationic moiety M2+in the structural moiety Y with H+ in the compound (II) has an acid dissociation constant a1 derived from an acidic moiety represented by HA1, formed by substituting the cationic moiety M1+ in the structural moiety X with H+, and an acid dissociation constant a2 derived from an acidic moiety represented by HA2, formed by substituting the cationic moiety M2+in the structural moiety Y with H+, and the acid dissociation constant a2 is larger than the acid dissociation constant a1, and
compound (III): a compound having the two or more structural moieties X and the following structural moiety Z, the compound generating an acid including the two or more first acidic moieties derived from the structural moieties X and the structural moiety Z upon irradiation with actinic rays or radiation,
structural moiety Z: a nonionic moiety capable of neutralizing an acid,
wherein the actinic ray-sensitive or radiation-sensitive resin composition is produced by mixing the first solution and a second solution including a second solvent having a higher SP value than the first solvent and the one or more compounds selected from the group consisting of the compound (I) to the compound (III).