US 12,235,497 B2
Optical module
Honghao Zhang, Shandong (CN); Benzheng Dong, Shandong (CN); Yifan Xie, Shandong (CN); Kai Liu, Shandong (CN); Qinhao Fu, Shandong (CN); Dan Li, Shandong (CN); and Tengfei Wang, Shandong (CN)
Assigned to HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Shandong (CN)
Filed by HISENSE BROADBAND MULTIMEDIA TECHNOLOGIES CO., LTD., Shandong (CN)
Filed on Mar. 27, 2024, as Appl. No. 18/619,079.
Application 18/619,079 is a continuation of application No. 17/853,792, filed on Jun. 29, 2022, granted, now 11,994,726.
Application 17/853,792 is a continuation of application No. PCT/CN2021/100998, filed on Jun. 18, 2021.
Claims priority of application No. 202011466271.8 (CN), filed on Dec. 14, 2020; application No. 202011475053.0 (CN), filed on Dec. 14, 2020; and application No. 202011475117.7 (CN), filed on Dec. 14, 2020.
Prior Publication US 2024/0241328 A1, Jul. 18, 2024
Int. Cl. H04B 10/00 (2013.01); G02B 6/42 (2006.01); H04B 10/40 (2013.01)
CPC G02B 6/4246 (2013.01) [G02B 6/4269 (2013.01); G02B 6/4292 (2013.01); H04B 10/40 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An optical module, comprising:
a circuit board;
a housing assembly comprising a light-receiving portion and a light-emitting cavity that are separated via a separation board and stacked one above the other, one side of the housing assembly adjacent to the circuit board being provided with a first notch, and one end of the circuit board is inserted into the housing assembly through the first notch;
a light-receiving assembly disposed in the light-receiving portion and electrically connected to an upper surface of the circuit board; and
a light-emitting assembly disposed in the light-emitting cavity and electrically connected to a lower surface of the circuit board; and
wherein a concave region is formed in a top plate of the light-emitting cavity, and a laser assembly of the light-emitting assembly is arranged in the concave region such that the laser assembly is lifted so as to reduce a height difference between a wire bonding surface of the laser assembly and the lower surface of the circuit board.