US 12,235,316 B2
Chip moving device
Zhe Lian, Suzhou (CN); Jianjun Huang, Suzhou (CN); Yonghong Wu, Suzhou (CN); Shan Zhao, Suzhou (CN); and Haiyang Hu, Suzhou (CN)
Assigned to SEMIGHT INSTRUMENTS CO., LTD, Suzhou (CN)
Filed by SEMIGHT INSTRUMENTS CO., LTD, Suzhou (CN)
Filed on Jan. 30, 2024, as Appl. No. 18/427,124.
Application 18/427,124 is a continuation of application No. PCT/CN2023/134138, filed on Nov. 24, 2023.
Claims priority of application No. 202310187136.7 (CN), filed on Mar. 1, 2023.
Prior Publication US 2024/0310435 A1, Sep. 19, 2024
Int. Cl. G01R 31/28 (2006.01)
CPC G01R 31/2893 (2013.01) 19 Claims
OG exemplary drawing
 
1. A chip moving device, comprising:
a base, including a mounting portion that includes an end surface and an assembly cavity extending in a horizontal direction and penetrating through the end surface, the end surface being arranged with a limiting component;
an adsorption part, extending in a vertical direction and confined by the limiting component; and
a clamping component, arranged in the assembly cavity and including an end extending out of the end surface of the mounting portion, the clamping component being configured to be telescopic in the horizontal direction, and provide the adsorption part with a clamping force in the horizontal direction when the clamping component is extended or contracted.