CPC G01R 31/2601 (2013.01) [G01R 1/07314 (2013.01)] | 8 Claims |
1. A composite intermediary device using vertical probe for wafer testing, comprising:
a printed circuit board, having a testing circuit, for connecting to a measuring apparatus, the bottom of the printed circuit board has a first contact;
a glass interposer arranged below the printed circuit board, the upper surface of the glass interposer has a printed circuit, the lower surface has multiple contact pads, multiple through holes set through the upper surface and the lower surface, and the through holes are filled with a conductive material, so as to electrically connect the printed circuit and the contact pads, and top of the glass interposer is provided with a second contact which connects with the printed circuit;
at least one flexible connecting plate, one end has a top connecting end to connect the first contact, the other end has a bottom connecting end to connect the second contact, between the top connecting end and the bottom connecting end have multiple transmission lines; and
a vertical probe set secured below the glass interposer, the vertical probe set has a guide plate, the guide plate having multiple via holes for arranging probes, and top end of each probe has a salient point connect to a contact pad.
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