US 12,235,313 B2
Composite intermediary device using vertical probe for wafer testing
Kun Yu Wu, Zhubei (TW); and Ming Tsung Tsai, Taoyuan (TW)
Assigned to SYU GUANG TECHNOLOGY CO., LTD., Zhubei (TW)
Filed by SYU GUANG TECHNOLOGY CO., LTD., Zhubei (TW)
Filed on Apr. 17, 2023, as Appl. No. 18/301,481.
Claims priority of application No. 111142022 (TW), filed on Nov. 3, 2022.
Prior Publication US 2024/0151764 A1, May 9, 2024
Int. Cl. G01R 31/26 (2020.01); G01R 1/073 (2006.01)
CPC G01R 31/2601 (2013.01) [G01R 1/07314 (2013.01)] 8 Claims
OG exemplary drawing
 
1. A composite intermediary device using vertical probe for wafer testing, comprising:
a printed circuit board, having a testing circuit, for connecting to a measuring apparatus, the bottom of the printed circuit board has a first contact;
a glass interposer arranged below the printed circuit board, the upper surface of the glass interposer has a printed circuit, the lower surface has multiple contact pads, multiple through holes set through the upper surface and the lower surface, and the through holes are filled with a conductive material, so as to electrically connect the printed circuit and the contact pads, and top of the glass interposer is provided with a second contact which connects with the printed circuit;
at least one flexible connecting plate, one end has a top connecting end to connect the first contact, the other end has a bottom connecting end to connect the second contact, between the top connecting end and the bottom connecting end have multiple transmission lines; and
a vertical probe set secured below the glass interposer, the vertical probe set has a guide plate, the guide plate having multiple via holes for arranging probes, and top end of each probe has a salient point connect to a contact pad.