US 12,235,287 B2
Substrate processing apparatus
Daesung Jung, Pohang-si (KR); Myeongock Ko, Hwaseong-si (KR); and Meehyun Lim, Seoul (KR)
Assigned to SAMSUNG ELECTRONICS CO., LTD., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed on Sep. 9, 2022, as Appl. No. 17/930,819.
Claims priority of application No. 10-2021-0167057 (KR), filed on Nov. 29, 2021.
Prior Publication US 2023/0168278 A1, Jun. 1, 2023
Int. Cl. G01R 1/07 (2006.01); G01R 1/04 (2006.01); G01R 1/067 (2006.01); G01R 1/073 (2006.01); G01R 31/20 (2006.01); G01R 31/28 (2006.01); G02B 27/28 (2006.01); H01L 21/683 (2006.01)
CPC G01R 1/071 (2013.01) [G02B 27/283 (2013.01); H01L 21/6833 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A substrate processing apparatus, comprising:
a chamber having an internal space configured for performance of a wet process therein;
a chuck in a lower region of the internal space;
a probe having one end above an upper portion of the chuck, and including an electro-optical crystal having an optical refractive index configured to change in proportion to a magnitude of an electric field applied at an upper portion of a semiconductor substrate loaded onto the chuck, and the probe further including a reflective mirror on one surface of the electro-optical crystal;
a measuring unit connected to the probe, the measuring unit being configured to provide reference light to the probe and to detect a polarization component of reflected light from the reference light that is reflected from the reflective mirror of the probe; and
a controller configured to calculate an amount of electrostatic charge on a surface of the semiconductor substrate from the polarization component detected by the measuring unit.