US 12,235,102 B2
Measuring device and measuring system
Tadao Senriuchi, Tokyo (JP); and Sadaharu Yoneda, Tokyo (JP)
Assigned to TDK Corporation, Tokyo (JP)
Appl. No. 17/768,438
Filed by TDK Corporation, Tokyo (JP)
PCT Filed Sep. 18, 2020, PCT No. PCT/JP2020/035638
§ 371(c)(1), (2) Date Apr. 12, 2022,
PCT Pub. No. WO2021/075214, PCT Pub. Date Apr. 22, 2021.
Claims priority of application No. 2019-190609 (JP), filed on Oct. 17, 2019; and application No. 2020-031137 (JP), filed on Feb. 27, 2020.
Prior Publication US 2023/0251076 A1, Aug. 10, 2023
Int. Cl. B60C 23/06 (2006.01); B60C 19/00 (2006.01); B60C 23/04 (2006.01); G01B 7/16 (2006.01); G01L 1/16 (2006.01); G01L 17/00 (2006.01); B60C 23/20 (2006.01); H01Q 1/22 (2006.01)
CPC G01B 7/20 (2013.01) [B60C 23/041 (2013.01); B60C 23/0483 (2013.01); B60C 23/064 (2013.01); G01L 1/16 (2013.01); G01L 17/005 (2013.01); B60C 2019/004 (2013.01); B60C 23/20 (2013.01); H01Q 1/2241 (2013.01)] 4 Claims
OG exemplary drawing
 
1. A measuring device comprising:
a first sensor provided on a surface of an object to be measured,
a case provided to ensure that the first sensor is located between the case and the object to be measured,
an elastic body interposed between the case and the object to be measured, and
a processing circuit which is provided inside the case and processes the output signal of the first sensor, wherein
the first sensor includes a strain sensor,
the strain sensor is a chip comprising a thin film piezoelectric element, the chip is mounted on a flexible substrate by wire bonding, and the flexible substrate has a wire connection part to which a wire extending to the outside is connected, and
a metal foil having a thickness of 20 μm or less is formed on a surface of the flexible substrate on a side opposite from the chip, and the metal foil includes at least a part corresponding to the direct back side part of the chip.