| CPC F24F 11/89 (2018.01) [F24F 13/20 (2013.01); H05K 1/0233 (2013.01); H05K 1/183 (2013.01); H05K 3/34 (2013.01); H05K 7/20909 (2013.01); F24F 2013/202 (2013.01); H05K 2201/10015 (2013.01); H05K 2201/10166 (2013.01); H05K 2201/10272 (2013.01)] | 17 Claims |

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1. An electronic module of an inverter for an electric compressor of a climate control system, comprising a circuit board and one or several power semiconductors and busbars, at least one intermediate circuit capacitor, an EMC filter coil, and a support structure comprising an outer support structure part that carries the circuit board and comprises securement devices to dispose the electronic module, utilizing securement elements, securely on a compressor housing along contact areas of the support structure located in a base plane, and an inner support structure part, framed by the outer support structure part, which is resiliently connected with the outer support structure part through a resilient lug, carries the one or the several power semiconductors and comprises the securement devices that permit securing the inner support structure part, utilizing securement elements, independently of the securement of the outer support structure part and the circuit board, on the compressor housing, wherein the contact areas for the securement of the inner support structure part on the compressor housing are at least partially formed by the power semiconductors, and wherein the inner support structure part in a non-secured state projects from the base plane, yet is displaceable through the resilient lug of the inner support structure part with the outer support structure part in a direction perpendicular to the base plane, such that the power semiconductors is pressed toward the compressor housing by a spring effect of the inner support structure part when the electric module is installed on the compressor housing, thereby a requisite contact pressure between the power semiconductors and the compressor housing is provided.
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