US 12,234,979 B2
Backlight module and display device
Qilin Li, Beijing (CN); and Qing Tian, Beijing (CN)
Assigned to Beijing BOE Chatani Electronics Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
Appl. No. 18/272,567
Filed by Beijing BOE Chatani Electronics Co., Ltd., Beijing (CN); and BOE Technology Group Co., Ltd., Beijing (CN)
PCT Filed Oct. 22, 2021, PCT No. PCT/CN2021/125514
§ 371(c)(1), (2) Date Jul. 15, 2023,
PCT Pub. No. WO2022/193648, PCT Pub. Date Sep. 22, 2022.
Claims priority of application No. 202120561202.9 (CN), filed on Mar. 18, 2021.
Prior Publication US 2024/0318814 A1, Sep. 26, 2024
Int. Cl. F21V 29/71 (2015.01); F21V 29/503 (2015.01); F21V 29/74 (2015.01); F21Y 115/10 (2016.01)
CPC F21V 29/713 (2015.01) [F21V 29/503 (2015.01); F21V 29/74 (2015.01); F21Y 2115/10 (2016.08)] 20 Claims
OG exemplary drawing
 
1. A backlight module, comprising:
a backplane, having a first surface and a second surface opposite each other;
a lamp board, arranged at the first surface of the backplane;
a thermally conductive connecting layer, arranged between the backplane and the lamp board, wherein the thermally conductive connecting layer is connected with the lamp board; and
a heat dissipation assembly, arranged at the second surface of the backplane, wherein the heat dissipation assembly passes through the backplane and is then connected with the thermally conductive connecting layer, the heat dissipation assembly comprises a heat sink;
wherein the backplane has a mounting hole for the heat sink to pass therethrough; and
a size of the mounting hole is greater than a size of the heat sink in a first direction.