US 12,234,555 B2
Substrate treating apparatus and filler member provided therein
Jin Mo Jae, Asan-si (KR); Seung Hoon Oh, Cheonan-si (KR); Young Seop Choi, Cheonan-si (KR); Mi So Park, Daejeon (KR); and Jong Hyeon Woo, Asan-si (KR)
Assigned to SEMES CO., LTD., Chungcheongnam-do (KR)
Filed by SEMES CO., LTD., Cheonan-si (KR)
Filed on Oct. 18, 2021, as Appl. No. 17/503,741.
Claims priority of application No. 10-2020-0172077 (KR), filed on Dec. 10, 2020.
Prior Publication US 2022/0186379 A1, Jun. 16, 2022
Int. Cl. C23C 18/16 (2006.01); H01L 21/67 (2006.01); H01L 21/687 (2006.01)
CPC C23C 18/1685 (2013.01) [C23C 18/1619 (2013.01); H01L 21/67034 (2013.01); H01L 21/67051 (2013.01); H01L 21/67103 (2013.01); H01L 21/6719 (2013.01); H01L 21/68785 (2013.01)] 20 Claims
OG exemplary drawing
 
1. An apparatus for treating a substrate, the apparatus comprising:
a vessel having a sealable process space formed therein in which the substrate is accommodated;
a supply port provided inside a wall of the vessel and configured to supply a process fluid into the process space;
an exhaust port provided inside the wall of the vessel and spaced apart from the supply port; and
a buffer member provided in the process space, the buffer member being provided in a position overlapping with the supply port and the exhaust port when viewed from above,
wherein the buffer member includes:
a sidewall portion located outward of the supply port and the exhaust port and configured to make contact with the wall of the vessel; and
an upper wall portion having a through-hole formed therein to correspond to a center of the substrate, wherein the through-hole forms a straight flow path in an up/down direction.