CPC C23C 16/4585 (2013.01) [C23C 16/455 (2013.01)] | 20 Claims |
1. A chemical vapor deposition system comprising:
chamber boundaries defining a deposition chamber having a deposition gas inlet at an upstream end and a gas outlet at a downstream end, the chamber boundaries defining a generally horizontal chamber passage configured to conduct gas flow along a gas flow direction therethrough, the chamber boundaries comprising quartz;
a susceptor configured to support a substrate thereon, the chamber boundaries above the susceptor being generally transparent to radiation energy;
a susceptor support ring positioned in the chamber passage between the gas inlet and the gas outlet;
a getter plate positioned generally horizontally within the deposition chamber, the getter plate extending generally parallel to the susceptor and extending laterally substantially across the deposition chamber;
a getter support comprising a support base and one or more first support posts, at least a portion of the getter support and at least one of the one or more first support posts comprising a coating comprising silicon carbide (SiC), the getter support being disposed a maximum distance of between about 1 mm and about 10 mm from the susceptor support ring; and
a getter support shelf configured to be disposed on a generally horizontal chamber boundary and to at least partially support the getter support, wherein the getter support shelf comprises:
one or more second support posts configured to support the getter plate and extending between the getter support and the getter support shelf, and
one or more recesses in a face thereof, the one or more recesses configured to receive corresponding ones of the one or more second support posts.
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