US 12,234,550 B2
Vaporizer, processing apparatus and method of manufacturing semiconductor device
Gen Li, Toyama (JP); Hirohisa Yamazaki, Toyama (JP); and Kenichi Suzaki, Toyama (JP)
Assigned to Kokusai Electric Corporation, Tokyo (JP)
Filed by Kokusai Electric Corporation, Tokyo (JP)
Filed on Nov. 30, 2023, as Appl. No. 18/525,207.
Application 18/525,207 is a continuation of application No. 17/204,210, filed on Mar. 17, 2021, granted, now 11,873,555.
Claims priority of application No. 2020-048652 (JP), filed on Mar. 19, 2020.
Prior Publication US 2024/0093361 A1, Mar. 21, 2024
This patent is subject to a terminal disclaimer.
Int. Cl. C23C 16/44 (2006.01); H01L 21/67 (2006.01)
CPC C23C 16/4405 (2013.01) [H01L 21/67017 (2013.01)] 20 Claims
OG exemplary drawing
 
1. A vaporizer comprising:
a vessel in which a source is stored;
a first heater immersed into the source stored in the vessel for heating the source;
a second heater capable of heating the vessel;
a first temperature sensor capable of measuring a temperature of the source by immersion into the source;
a second temperature sensor capable of measuring a temperature of the vessel; and
a controller capable of controlling the first heater based on the temperature measured by the first temperature sensor and controlling the second heater based on the temperature measured by the second temperature sensor.