US 12,234,382 B2
CMP composition including anionic and cationic inhibitors
Hsin-Yen Wu, Kaohsiung (TW); Jin-Hao Jhang, Taichung (TW); and Cheng-Yuan Ko, Kaohsiung (TW)
Assigned to CMC Materials LLC, Aurora, IL (US)
Filed by CMC Materials, Inc., Aurora, IL (US)
Filed on Jul. 26, 2021, as Appl. No. 17/384,940.
Claims priority of provisional application 63/077,036, filed on Sep. 11, 2020.
Claims priority of provisional application 63/057,639, filed on Jul. 28, 2020.
Prior Publication US 2022/0033682 A1, Feb. 3, 2022
Int. Cl. C09G 1/02 (2006.01); C09K 3/14 (2006.01); C09K 13/00 (2006.01); H01L 21/321 (2006.01); H01L 21/768 (2006.01)
CPC C09G 1/02 (2013.01) [C09K 3/1409 (2013.01); C09K 13/00 (2013.01); H01L 21/3212 (2013.01); H01L 21/7684 (2013.01)] 13 Claims
 
1. A chemical mechanical polishing composition comprising:
a water based liquid carrier;
abrasive particles dispersed in the liquid carrier;
an amino acid selected from the group consisting of arginine, histidine, cysteine, lysine, and mixtures thereof;
an amino acid surfactant; and
an anionic polymer or an anionic surfactant, wherein the anionic polymer is selected from the group consisting of polysulfonic acids, polyacrylic acids, and polyphosphoric acids, and further comprising:
an iron-containing accelerator from about 20 to about 2000 ppm Fe at point of use; and a stabilizer bound to the iron-containing accelerator, wherein the stabilizer comprises phosphoric acid, acetic acid, phthalic acid, citric acid, adipic acid, oxalic acid, malonic acid, aspartic acid, succinic acid, glutaric acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, maleic acid, glutaconic acid, muconic acid, ethylenediaminetetraacetic acid EDTA), propylenediaminetetraacetic acid (PDTA), and mixtures thereof.