US 12,234,376 B2
Film forming formulation and composition thereof
Douglas E. Moon, Glenview, IL (US)
Assigned to Illinois Tool Works Inc., Glenview, IL (US)
Filed by Illinois Tool Works Inc., Glenview, IL (US)
Filed on Aug. 31, 2023, as Appl. No. 18/240,432.
Application 18/240,432 is a division of application No. 16/515,746, filed on Jul. 18, 2019, granted, now 11,760,901.
Claims priority of provisional application 62/700,467, filed on Jul. 19, 2018.
Prior Publication US 2024/0002694 A1, Jan. 4, 2024
Int. Cl. C08G 77/18 (2006.01); C08K 3/32 (2006.01); C09D 4/00 (2006.01); C09D 183/04 (2006.01); C09D 183/06 (2006.01); C09D 183/08 (2006.01); B29C 33/60 (2006.01); C08G 77/14 (2006.01); C08G 77/395 (2006.01)
CPC C09D 183/06 (2013.01) [C08G 77/18 (2013.01); C08K 3/32 (2013.01); C09D 4/00 (2013.01); C09D 183/04 (2013.01); C09D 183/08 (2013.01); B29C 33/60 (2013.01); C08G 77/14 (2013.01); C08G 77/395 (2013.01)] 15 Claims
 
1. A mold release coating composition comprising:
a formulation comprising reaction products of phosphoric acid with a ring alkoxy silane, where the phosphoric acid and the ring alkoxy silane are present in a molecular ratio of from 0.9-3.3:1;
a release agent that is a mono epoxide release agent;
a base; and
an aqueous solvent.