US 12,234,344 B2
Resin composition, resin cured product, and composite molded body
Akinori Kimura, Tokyo (JP); Toshiyuki Tanaka, Tokyo (JP); Dao Thi Kim Phuong, Tokyo (JP); Tomoki Kato, Tokyo (JP); and Toshiyuki Sawamura, Tokyo (JP)
Assigned to Mitsubishi Chemical Corporation, Tokyo (JP)
Filed by Mitsubishi Chemical Corporation, Tokyo (JP)
Filed on Mar. 19, 2021, as Appl. No. 17/206,389.
Application 17/206,389 is a continuation of application No. PCT/JP2019/039448, filed on Oct. 7, 2019.
Claims priority of application No. 2018-192691 (JP), filed on Oct. 11, 2018.
Prior Publication US 2021/0206943 A1, Jul. 8, 2021
Int. Cl. C08K 3/38 (2006.01); C08K 5/3492 (2006.01); H01L 23/373 (2006.01)
CPC C08K 3/38 (2013.01) [C08K 5/3492 (2013.01); C08K 2003/385 (2013.01); H01L 23/3737 (2013.01)] 10 Claims
 
1. A resin composition comprising a resin and an aggregated inorganic filler,
wherein the resin comprises a multifunctional epoxy resin including four or more epoxy groups per molecule,
wherein the multifunctional epoxy resin has a molecular weight of 600 or less,
wherein the resin comprises a specific epoxy resin having a biphenyl structure, and a weight-average molecular weight of 10,000 or more,
wherein the specific epoxy resin is 1% by weight or more and 50% by weight or less relative to 100% by weight of a solid content in the resin composition excluding the aggregated inorganic filler,
wherein the biphenyl structure is represented by Structural Formula (3) below

OG Complex Work Unit Chemistry
wherein R4 to R7 each independently represent an alkyl group having a molecular weight of 15 to 1,000, or an aryl group having a molecular weight of 15 to 1,000,
wherein a dielectric breakdown voltage (BDV) of a cured product of the resin composition after a moisture absorption reflow test is 5 kV or more,
wherein an increase in a weight of a cured product of the resin composition at 85° C. and 85% RH is 0.80% or less, and
wherein a storage modulus of a cured product of the resin composition excluding the inorganic filler at 200° C. is 1.0×107 Pa or more.