US 12,234,343 B2
Photovoltaic encapsulant films comprising fumed alumina
Yunfeng Yang, Shanghai (CN); Brian M. Habersberger, Houston, TX (US); Weiming Ma, Shanghai (CN); Yuyan Li, Shanghai (CN); Hong Yang, Shanghai (CN); and Chao He, Shanghai (CN)
Assigned to Dow Global Technologies LLC, Midland, MI (US)
Appl. No. 17/638,399
Filed by Dow Global Technologies LLC, Midland, MI (US)
PCT Filed Aug. 30, 2019, PCT No. PCT/CN2019/103788
§ 371(c)(1), (2) Date Feb. 25, 2022,
PCT Pub. No. WO2021/035713, PCT Pub. Date Mar. 4, 2021.
Prior Publication US 2022/0306831 A1, Sep. 29, 2022
Int. Cl. C08K 3/22 (2006.01); C08K 5/00 (2006.01); C08K 5/14 (2006.01); C08K 5/54 (2006.01); C08K 5/5425 (2006.01); H01L 31/048 (2014.01)
CPC C08K 3/22 (2013.01) [C08K 5/0025 (2013.01); C08K 5/14 (2013.01); C08K 5/5425 (2013.01); H01L 31/0481 (2013.01); C08K 2003/2227 (2013.01)] 9 Claims
 
1. A curable composition for an encapsulant film, the curable composition comprising:
(A) from 80 wt % to 99 wt % of an ethylene/1-octene random copolymer with a density from 0.860 g/cc to 0.890 g/cc, and a melt index from 5 g/10 min to 20 g/10 min, based on the total weight of the curable composition;
(B) from 0.01 wt % to 5 wt % of a fumed alumina with a specific surface area (BET) from greater than 50 m2/g to less than 200 m2/g, based on the total weight of the curable composition;
(C) from 0.1 wt % to 5 wt % of an organic peroxide, based on the total weight of the curable composition;
(D) from 0.01 wt % to 2 wt % of a silane coupling agent, based on the total weight of the curable composition;
(E) from 0.01 wt % to 5 wt % of a cross-linking co-agent, based on the total weight of the curable composition; and
(F) from 0 wt % to 1 wt % of an additive component comprising an antioxidant, based on the total weight of the curable composition,
wherein the ethylene/1-octene random copolymer has a volume resistivity from greater than 1.0E+12 to less than 4.0E+15 ohm·cm.