US 12,234,339 B2
Conductive resin, manufacturing method for the same, and sensor
Ayako Yoshida, Yamagata (JP); Yi-Fei Wang, Yamagata (JP); and Shizuo Tokito, Yamagata (JP)
Assigned to National University Corporation Yamagata University, Yamagata (JP)
Filed by National University Corporation Yamagata University, Yamagata (JP)
Filed on May 16, 2023, as Appl. No. 18/318,184.
Application 18/318,184 is a continuation of application No. PCT/JP2021/041218, filed on Nov. 9, 2021.
Claims priority of application No. 2020-197319 (JP), filed on Nov. 27, 2020.
Prior Publication US 2023/0323067 A1, Oct. 12, 2023
Int. Cl. C08J 9/28 (2006.01); C08J 3/28 (2006.01); C08J 9/00 (2006.01)
CPC C08J 9/28 (2013.01) [C08J 3/28 (2013.01); C08J 9/0023 (2013.01); C08J 9/0028 (2013.01); C08J 2383/04 (2013.01)] 2 Claims
OG exemplary drawing
 
1. A manufacturing method for manufacturing conductive resin comprising:
mixing a hydrogen bond donor compound and a hydrogen bond acceptor compound to produce deep eutectic liquid (DEL);
adding conductive materials to the DEL to produce gel;
adding resin that is insoluble in the DEL to the gel to produce ink made of the gel dispersed in the resin;
forming the produced ink into a formed object having a desired shape;
curing the resin in the formed object; and
evaporating the DEL in the formed object including the cured resin to produce porous conductive resin.