	US 12,234,325 B2
	Resin composition, prepreg, laminate, metal foil-clad laminate, and printed circuit board
Hongjie Li, Guangdong (CN); and Junqi Tang, Guangdong (CN)
Assigned to SHENGYI TECHNOLOGY CO., LTD., Guangdong (CN)
Appl. No. 17/614,169
Filed by Shengyi Technology Co., Ltd., Guangdong (CN)
PCT Filed May 31, 2019, PCT No. PCT/CN2019/089557 § 371(c)(1), (2) Date Nov. 24, 2021, PCT Pub. No. WO2020/237634, PCT Pub. Date Dec. 3, 2020.
Prior Publication US 2022/0227942 A1, Jul. 21, 2022
Int. Cl. C08G 73/10 (2006.01); C08L 63/00 (2006.01); C08L 67/02 (2006.01)

CPC C08G 73/1078 (2013.01) [C08L 63/00 (2013.01); C08L 67/02 (2013.01); C08L 2205/035 (2013.01)]

18 Claims

1. A resin composition, comprising:

a modified maleimide resin obtained by means of reacting a maleimide compound having at least two maleimide groups/molecules with an amine compound having at least one primary amine group/molecule and an amine compound having at least two primary amine groups/molecules, and has the molecular weight distribution that molecules having a molecular weight between 1000 and 4500 account for 30-50% of the total number of molecules,

an active ester resin, and

an epoxy resin.