US 12,234,318 B2
Thermosetting epoxy resin composition and prepreg, laminated board and printed circuit board using thermosetting epoxy resin composition
Yong Chen, Guangdong (CN); Yongjing Xu, Guangdong (CN); and Guofang Tang, Guangdong (CN)
Assigned to SHENGYI TECHNOLOGY CO., LTD., (CN)
Appl. No. 17/787,424
Filed by SHENGYI TECHNOLOGY CO., LTD., Guangdong (CN)
PCT Filed Mar. 31, 2020, PCT No. PCT/CN2020/082466
§ 371(c)(1), (2) Date Jun. 20, 2022,
PCT Pub. No. WO2021/128630, PCT Pub. Date Jul. 1, 2021.
Claims priority of application No. 201911369409.X (CN), filed on Dec. 26, 2019.
Prior Publication US 2023/0045615 A1, Feb. 9, 2023
Int. Cl. B32B 15/092 (2006.01); B32B 7/12 (2006.01); B32B 15/14 (2006.01); B32B 15/20 (2006.01); B32B 27/38 (2006.01); C08G 59/40 (2006.01); C08G 59/42 (2006.01); C08J 5/24 (2006.01); C08K 3/22 (2006.01); C08K 3/32 (2006.01); C08K 3/36 (2006.01); C08K 5/5313 (2006.01); C08K 5/5377 (2006.01); C08K 5/5419 (2006.01); B32B 5/02 (2006.01); B32B 5/26 (2006.01)
CPC C08G 59/4238 (2013.01) [B32B 7/12 (2013.01); B32B 15/14 (2013.01); B32B 15/20 (2013.01); C08G 59/4223 (2013.01); C08G 59/4261 (2013.01); C08J 5/244 (2021.05); C08K 3/22 (2013.01); C08K 3/32 (2013.01); C08K 3/36 (2013.01); C08K 5/5313 (2013.01); C08K 5/5377 (2013.01); C08K 5/5419 (2013.01); B32B 5/022 (2013.01); B32B 5/024 (2013.01); B32B 5/26 (2013.01); B32B 2250/40 (2013.01); B32B 2255/06 (2013.01); B32B 2255/26 (2013.01); B32B 2260/023 (2013.01); B32B 2260/046 (2013.01); B32B 2262/101 (2013.01); B32B 2457/08 (2013.01); C08J 2363/00 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/2241 (2013.01); C08K 2003/327 (2013.01); C08K 2201/003 (2013.01)] 16 Claims
 
1. A thermosetting epoxy resin composition, comprising the following components in part by weight:
Component A: 2-10 parts of a phosphorus-containing anhydride, Component B: 5-40 parts of a phosphorus-free anhydride, Component C: 5-45 parts of an epoxy resin, Component D: 40-70 parts of a filler, and Component E: 0-15 parts of a phosphorus-containing flame retardant;
the total part by weight of the Component A, Component B, Component C, Component D and Component E is 100 parts;
the phosphorus-containing anhydride has a structure represented by Formula I or Formula II as follows:

OG Complex Work Unit Chemistry
wherein R1 and R2 are each independently selected from any one of hydrogen, C1-C5 alkyl, substituted phenyl, unsubstituted phenyl, substituted naphthyl, and unsubstituted naphthyl;
R3 is selected from any one of hydrogen, C1-C5 alkyl, siloxy and siloxyalkyl;
X1 and X2 are each independently selected from any one of

OG Complex Work Unit Chemistry
wherein * represents a linkage site of the group;
R11 and R12 are each independently selected from any one of C1-C5 alkyl, benzoxazinyl, substituted phenyl, unsubstituted phenyl, substituted naphthyl, and unsubstituted naphthyl;
when the above group contains a substituent, the substituent is a halogen atom or a C1-C5 linear or branched alkyl group;
wherein the epoxy resin is selected from a bisphenol A epoxy resin, a bisphenol F epoxy resin, a biphenyl epoxy resin, and combinations thereof;
wherein the epoxy resin of Component C is the only epoxy resin present in the composition; and
wherein the filler is titanium dioxide.
 
13. A prepreg, comprising a reinforcing material, and the thermosetting epoxy resin composition according to claim 1 which is adhered to the reinforcing material after impregnating and drying.
 
15. A metal foil-clad laminate, comprising one or at least two stacked prepregs according to claim 13, and a metal foil covering on one or two sides of the one prepreg or the stacked prepregs.
 
16. A printed circuit board, which is prepared through a method of removing part of the metal foil on the surface of the metal foil-clad laminate according to claim 15 to form a circuit.