US 12,234,173 B2
Electronic device including back surface plate and manufacturing method of back surface plate
Hosoon Lee, Gyeonggi-do (KR); Wonsun Lee, Gyeonggi-do (KR); and Hyunsuk Choi, Gyeonggi-do (KR)
Assigned to Samsung Electronics Co., Ltd., Suwon-si (KR)
Filed by Samsung Electronics Co., Ltd., Gyeonggi-do (KR)
Filed on Apr. 21, 2022, as Appl. No. 17/725,714.
Application 17/725,714 is a continuation of application No. PCT/KR2022/005108, filed on Apr. 8, 2022.
Claims priority of application No. 10-2021-0076698 (KR), filed on Jun. 14, 2021.
Prior Publication US 2022/0396515 A1, Dec. 15, 2022
Int. Cl. G06F 1/16 (2006.01); C03B 11/00 (2006.01); C03B 23/20 (2006.01)
CPC C03B 11/00 (2013.01) [C03B 23/20 (2013.01); G06F 1/1633 (2013.01); C03B 2215/406 (2013.01); C03B 2215/41 (2013.01)] 19 Claims
OG exemplary drawing
 
1. A back surface plate configured to form a back surface of an electronic device, the back surface plate comprising:
a first glass part including a first pattern area including a pattern having a predetermined shape on a first surface; and
a second glass part at least portion of which is disposed on the first surface of the first glass part, the second glass part including a first shape complimentary to the first pattern area,
wherein the second glass part has a color different from a color of the first glass part,
wherein a softening point of the second glass part is lower than a softening point of the first glass part.