a step of preparing a support member having a surface;

a coating step of applying a coating film member onto the surface of the support member to obtain a laminate including the coating film member;

a baking step of carrying out a baking treatment, after the coating step, to the laminate including the coating film member;

a sandwiching step of laminating a peeled-off member on the coating film member subjected to the baking treatment to sandwich the coating film member between the support member and the peeled-off member;

a film thickness adjusting step, which is carried out subsequently to and separately from the sandwiching step, of applying an external force to the coating film member sandwiched between the support member and the peeled-off member to reduce a thickness of the coating film member;

a peeling step of peeling the peeled-off member off the coating film member, which is conducted subsequently to the film thickness adjusting step, to obtain the coating film member laminated on the support member;

a flow channel forming member processing step of forming the flow channel, after attaching a silicon substrate to the coating film member laminated on the support member and then peeling the support member, to obtain the flow channel forming member laminated on the silicon substrate; and

an ejection orifice forming member processing step of forming the ejection orifice, after attaching a second coating film member laminated on a second support member manufactured separately in the same manner as the coating film member processed to the flow channel forming member laminated on the silicon substrate such that the second coating film member is laminated on the second support member with the flow channel forming member on the silicon substrate and then peeling the second support member, to obtain the ejection orifice forming member laminated on the flow channel forming member laminated on the silicon substrate.