US 12,233,645 B2
Fluidic die having trickle-warming and pulse-warming circuits
Eric Thomas Martin, Corvallis, OR (US); Garrett E. Clark, Corvallis, OR (US); Jeremy Spencer, Corvallis, OR (US); Vincent C. Korthuis, Corvallis, OR (US); and Rogelio Cicili, San Diego, CA (US)
Assigned to Hewlett-Packard Development Company, L.P., Spring, TX (US)
Appl. No. 18/018,253
Filed by Hewlett-Packard Development Company, L.P., Spring, TX (US)
PCT Filed Jul. 31, 2020, PCT No. PCT/US2020/044429
§ 371(c)(1), (2) Date Jan. 26, 2023,
PCT Pub. No. WO2022/025915, PCT Pub. Date Feb. 3, 2022.
Prior Publication US 2023/0286262 A1, Sep. 14, 2023
Int. Cl. B41J 2/045 (2006.01)
CPC B41J 2/04541 (2013.01) [B41J 2/0458 (2013.01)] 15 Claims
OG exemplary drawing
 
1. A fluid-transfer system comprising:
a fluidic die comprising:
a plurality of fluid-transfer elements, each fluid-transfer element comprising a firing element that is energized to transfer fluid;
a temperature sensor to monitor a temperature on the fluidic die;
a trickle-warming circuit to warm the fluid transferrable by the fluid-transfer elements, the trickle-warming circuit comprising a warming element separate from the firing element and that is energized to warm the fluid;
a pulse-warming circuit to warm the fluid; and
a warming control circuit to selectively activate the trickle-warming and pulse-warming circuits.