US 12,233,639 B2
Source wafer, method, and optoelectronic devices
Hua Yang, Cork (IE); Mohamad Dernaika, Cork (IE); Frank Peters, Cork (IE); and Guomin Yu, Glendora, CA (US)
Assigned to Rockley Photonics Limited, Altrincham (GB)
Filed by ROCKLEY PHOTONICS LIMITED, Altrincham (GB)
Filed on Oct. 5, 2022, as Appl. No. 17/938,282.
Claims priority of application No. 2114242 (GB), filed on Oct. 5, 2021.
Prior Publication US 2023/0105335 A1, Apr. 6, 2023
Int. Cl. B32B 27/02 (2006.01); B41F 16/00 (2006.01); H01L 21/683 (2006.01)
CPC B41F 16/0066 (2013.01) [H01L 21/6835 (2013.01); H01L 2221/68318 (2013.01); H01L 2221/68363 (2013.01)] 17 Claims
OG exemplary drawing
 
1. A source wafer, for use in a micro-transfer printing process, the source wafer comprising:
a wafer substrate;
a photonic component, provided in a device coupon, the device coupon being attached to the wafer substrate via a release layer; and
one or more etch stop layers, located between the photonic component and the wafer substrate,
wherein a first etch stop layer of the one or more etch stop layers is located between the photonic component and the release layer, and
wherein the source wafer further comprises an intermediate semiconductor layer, located between the etch stop layer and the release layer.