CPC B32B 7/12 (2013.01) [B32B 17/10 (2013.01); B32B 27/281 (2013.01); B32B 27/38 (2013.01); G02B 1/14 (2015.01); B32B 2250/02 (2013.01); B32B 2255/10 (2013.01); B32B 2255/26 (2013.01); B32B 2307/3065 (2013.01); B32B 2307/412 (2013.01); B32B 2307/536 (2013.01); B32B 2307/732 (2013.01); B32B 2457/20 (2013.01); B32B 2457/202 (2013.01)] | 13 Claims |
1. A protective film for glass substrate protective film comprising:
an optically transparent adhesive layer;
a polyimide-based shatter-proof layer formed on the optically transparent adhesive layer; and
a hard coating layer formed on the polyimide-based shatter-proof layer,
wherein the hard coating layer and the optically transparent adhesive layer have a thickness of 5 to 20 μm, respectively, the polyimide-based shatter-proof layer has a thickness of 20 to 50 μm,
wherein the polyimide-based shatter-proof layer includes a polyimide polymer including a unit derived from an aromatic diamine containing fluorine atom, and an aromatic dianhydride,
wherein the aromatic dianhydride comprises BPAF (9,9-bis(3,4-dicarboxyphenyl) fluorene dianhydride), and
wherein the hard coating layer includes a unit derived from a condensate of alkoxysilane having an epoxy group.
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8. A method for manufacturing a glass substrate laminate, the method comprising:
applying a hard coating layer forming composition on one surface of a polyimide-based shatter-proof layer and curing the composition to form a hard coating layer;
attaching an optically transparent adhesive layer to the other surface of the polyimide-based shatter-proof layer; and
laminating a glass substrate on the optically transparent adhesive layer,
wherein the hard coating layer and the optically transparent adhesive layer have a thickness of 5 to 20 μm, respectively, the polyimide-based shatter-proof layer has a thickness of 20 to 50 μm, the glass substrate laminate has an absolute value of a retardation in a thickness direction (Rth) of 2000 nm or less, and an adhesive strength between the glass substrate and the optically transparent adhesive layer is 200 gf/in or more,
wherein the polyimide-based shatter-proof layer includes a polyimide polymer including a unit derived from an aromatic diamine containing fluorine atom, and an aromatic dianhydride,
wherein the aromatic dianhydride comprises BPAF (9,9-bis(3,4-dicarboxyphenyl) fluorene dianhydride), and
wherein the hard coating layer includes a unit derived from a condensate of alkoxysilane having an epoxy group.
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