US 12,233,630 B2
In-mold electronic component and method for manufacturing the same
Ten-Hsing Jaw, Chengdu (CN); Han Lung Tsai, Chengdu (CN); and I-chang Kuan, Chengdu (CN)
Assigned to Interface Technology (ChengDu) Co., Ltd., Chengdu (CN); Interface Optoelectronics (Shenzhen) Co., Ltd., Shenzhen (CN); and General Interface Solution Limited, Miaoli County (TW)
Filed by Interface Technology (ChengDu) Co., Ltd., Chengdu (CN); Interface Optoelectronics (Shenzhen) Co., Ltd., Shenzhen (CN); and General Interface Solution Limited, Miaoli County (TW)
Filed on Mar. 16, 2021, as Appl. No. 17/203,451.
Claims priority of application No. 202010354699.7 (CN), filed on Apr. 29, 2020.
Prior Publication US 2021/0345490 A1, Nov. 4, 2021
Int. Cl. B32B 3/26 (2006.01); B32B 27/06 (2006.01)
CPC B32B 3/266 (2013.01) [B32B 27/06 (2013.01); B32B 2457/20 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An in-mold electronic component, comprising:
a first film layer provided at a top surface of the in-mold electronic component;
a functional module comprising a circuit layer and an electronic component electrically connected to circuit layer;
a plastic layer configured to seal the functional module; and
a lead-out terminal, one end of the lead-out terminal being electrically connected to the circuit layer, and the other end of the lead-out terminal being led out to a rear surface of the in-mold electronic component;
wherein the electronic component comprises a display unit and a touch unit, the display unit and the touch unit are both electrically connected to the circuit layer; the top surface comprises a display area corresponding to the display unit and a touch area corresponding to the touch unit, the display area and the touch area are coincided with each other, the display unit and the touch unit are laminated, and the display unit and the touch unit are provided with an insulating layer therebetween;
wherein the first film layer is provided with a decorative layer on a side thereof away from the top surface, the circuit layer is attached to a side of the decorative layer away from the first film layer, the plastic layer is located on a side of the circuit layer away from the decorative layer and is configured to seal the decorative layer, the functional module, and a part of the lead-out terminal.