US 12,233,622 B2
Electromagnetic interference shielding film and preparing methods thereof
Wei-Chih Lee, Hsin-Chu County (TW); Chih-Ming Lin, Hsin-Chu County (TW); Chia-Hua Ho, Hsin-Chu County (TW); and Chien-Hui Lee, Hsin-Chu County (TW)
Assigned to ASIA ELECTRONIC MATERIAL CO., LTD., Hsin-Chu County (TW)
Filed by ASIA ELECTRONIC MATERIAL CO., LTD., Hsin-Chu County (TW)
Filed on Aug. 30, 2022, as Appl. No. 17/898,679.
Claims priority of application No. 110132089 (TW), filed on Aug. 30, 2021.
Prior Publication US 2023/0065194 A1, Mar. 2, 2023
Int. Cl. B32B 15/08 (2006.01); B32B 7/12 (2006.01); B32B 15/20 (2006.01); B32B 27/18 (2006.01); B32B 27/28 (2006.01); B32B 37/12 (2006.01); B32B 37/18 (2006.01); H05K 9/00 (2006.01)
CPC B32B 15/08 (2013.01) [B32B 7/12 (2013.01); B32B 15/20 (2013.01); B32B 27/18 (2013.01); B32B 27/281 (2013.01); B32B 37/12 (2013.01); B32B 37/182 (2013.01); H05K 9/0088 (2013.01); B32B 2264/1022 (2020.08); B32B 2264/108 (2013.01); B32B 2305/026 (2013.01); B32B 2307/206 (2013.01); B32B 2307/212 (2013.01); B32B 2307/4026 (2013.01); B32B 2307/406 (2013.01); B32B 2307/536 (2013.01); B32B 2307/538 (2013.01); B32B 2307/732 (2013.01); B32B 2307/748 (2013.01); B32B 2311/04 (2013.01); B32B 2311/08 (2013.01); B32B 2311/12 (2013.01); B32B 2311/14 (2013.01); B32B 2311/16 (2013.01); B32B 2311/22 (2013.01); B32B 2311/24 (2013.01); B32B 2311/30 (2013.01); B32B 2367/00 (2013.01); B32B 2379/08 (2013.01); B32B 2457/00 (2013.01)] 11 Claims
OG exemplary drawing
 
1. An electromagnetic interference shielding film comprising:
an insulation layer with pencil hardness of 2H to 6H, which includes a pigment, an inorganic additive, or a combination thereof;
a first adhesive layer formed on the insulation layer;
a porous metal layer having a plurality of micropores with a diameter of 1 to 120 microns, which is formed on the first adhesive layer, allowing the first adhesive layer to be located between the porous metal layer and the insulation layer, wherein a porosity of the porous metal layer is 15% to 30%, a tensile strength of the porous metal layer is equal to or greater than 20 kgf/mm2, and an elongation of the porous metal layer is equal to or greater than 5%; and
a conductive adhesive layer with a plurality of conductive particles, which is formed on the porous metal layer, allowing the porous metal layer to be located between the first adhesive layer and the conductive adhesive layer,
wherein the insulation layer is a double-layer insulation layer, one layer of the double-layer insulation layers has no inorganic additive added, and the other layer of the double-layer insulation layers comprises the inorganic additive.